ARTICLES
probes placed on G
1
showed no change in electrical characteristics
over a much larger range of loading.
Figure 5c,d shows the four-probe resistance as a funct ion of the
spacing between G
2
and G
1
. For low bias voltages (few millivolts),
all measured current–voltage characteristics, I
1,4
(V
2,3
), are linear.
The interlayer resistance varies exponentially with the deformation
of G
2
, from which we identify direct tunnelling between π-orbitals
on the adjacent graphene sheets as the conduction mechanism.
We fit the measured resistance to a one-dimensional tunnelling
model
30
, I ∝ V exp(−2d
√
2m
e
φ/
¯
h), where d and φ are the
width and constant height (at low V) of the tunnelling barrier,
respectively, and m
e
denotes the electron (effective) mass. Assuming
m
e
= m
0
, we find a barrier height of 5.0 eV, consistent with very
weak electronic interlayer coupling of the undeformed graphene
stack at room temperature.
Our experiments on a specific model system—single- and two-
layer graphene grown epitaxially on a Ru(0001) template—provide
evidence for the feasibility of synthesizing large monocr ystalline
epitaxial graphene domains. A comparison with graphene on
SiC, the epitaxial system that has received most attention so far,
shows surprisingly similar substrate interactions in both cases: a
first graphene layer is spaced closely (1.45
˚
A for Ru; 1.65
˚
A for
4H-SiC(000
¯
1) (ref. 32)) and interacts strongly with the substrate,
as reflected by a drastic suppression of the work function
33
. This
layer, which will have distinct electronic and chemical properties
that are yet to be explored, may be seen as a buffer layer supporting
the second graphene sheet that is largely decoupled structurally and
electronically, but is doped owing to residual charge t ransfer from
the substrate
8
. Significant differences between graphene epitaxy
on Ru(0001) and SiC clearly lie in the process conditions and
in the level of structural control achievable. Si sublimation on
SiC at high temperatures (between 1,250 and 1,450
◦
C) apparently
leads to small (<1 µm) multilayer graphene nuclei. Epitaxy on
Ru(0001) at lower temperatures (∼850
◦
C) produces sparse arrays
of graphene nuclei that grow in a controlled layer-by-layer mode to
macroscopic dimensions.
Our findings open up a number of avenues for exploiting
graphene epitaxy on transition-metal templates. The large first-
layer graphene domains could be isolated if etch processes are found
that selectively remove the Ru substrate but do not damage the
graphene layer
1
. It can be predicted that the weakly bound second
graphene layer be transferred to another substrate, for example,
using intercalation to further weaken the interlayer bonding
34
,
analogous to the layer transfer methods used successfully for
other e lectronic materials, such as Ge and strained Si (ref. 35). A
perhaps more intriguing possibility is the integration with other
materials by using lithographically patterned transition-metal pads
as a catalyst and template for directed local graphene growth.
A similar seeding approach using catalytic Au nanoparticles has
been established recently to assemble highly ordered few-layer
graphene sheets conformally on semiconductor (Ge (ref. 36), GaN
(ref. 37)) nanowires. Finally, our demonstration of an atomic-layer
switch, the out-of-plane conductance of which is reversibly altered
over three orders of magnitude by tuning the graphene-substrate
coupling, suggests the possibility of controlling the in-plane carrier
transport in epitaxial or cleaved bilayer or few-layer graphene by
‘mechanical gating’, that is, local mechanical deformations of the
layer stack.
METHODS
GRAPHENE GROWTH AND STRUCTURAL ANALYSIS
Graphene growth was carried out by thermal cycling of a Ru(0001) single crystal
in UHV, as described in the text, while observing the process by in situ LEEM.
Time-lapse LEEM movies were obtained during growth of the first and second
epitaxial graphene layer. Selected-area low-energy electron diffraction was
carried out on micrometre-sized areas of the bare Ru substrate, as well as the
first and second graphene layer. Local intensity–voltage (I(V )) characteristics
were obtained from real-space images of uniform Ru metal, one-layer and
two-layer g raphene, acquired as a function of incident electron energy. Layer
spacings were determined by comparing measured I (V ) characteristics for
the specular diffrac ted beam at very low electron energies (1–40 eV) with
simulations by dynamical multiple-scattering low-energy electron diffraction
theory
20
. As an approximation to the incommensurate moir
´
e structure
observed experimentally, the simulations assumed graphene fully strained
to the Ru substrate, with C atoms occupying hexagonal close-packed and
face-centred-cubic hollow sites. We thus achieved a faithful representation of
the out-of-plane layer separations at reasonable computational efficiency.
MICRO-RAMAN SPECTROSCOPY AND MICROSCOPY
Micro-Raman spectra and Raman maps were obtained on both epitaxial
graphene on Ru(0001) and on a reference sample of mechanically cleaved
monolayer graphene in a commercial confocal R aman microscope (WiTec).
We used an excitation wavelength of 532 nm at incident power below 1 mW,
and a ×100 objective providing a diffraction-limited spot size of about 400 nm.
Raman maps were acquired by measuring complete spectra on a 0.5 µm grid
over a 25 µm×25 µm sample area. Figure 4b,c was obtained by lorentzian fits to
the G and 2D Raman bands, and plotting the spatial distribution of the Raman
shifts of these bands.
TRANSPORT MEASUREMENTS
Electrical transport measurements were carried out in UHV in a commercial
system (Omicron Nanotechnology) that enables positioning of four
independent probe tips with nanometre accuracy on the sample while
observing the process by field-emission scanning electron microscopy (SEM).
The probes consisted of electrochemically sharpened tungsten wires mounted
on and manipulated by piezoelectric actuator elements, and projecting under
45
◦
onto the sample surface. Their tips were placed above selected epitaxial
graphene structures, biased relative to the sample, and then approached
individually until a tunnelling current was detected. From this tunnelling
contact, the tips were carefully brought into mechanical contact, as judged
from the onset of linear low-bias four-probe current–voltage char acteristics.
A controlled compression of the graphene layer G
2
and measurement of the
resulting change in interlayer electrical resistance was achieved by driving
one of the probes on G
2
closer to the sample using a piezoelectric actuator
while measuring both the displacement of the actuator and the four-probe
resistance between G
1
and G
2
. The different stiffnesses of the probe wire
(10 mm long, 0.25 mm diameter) and of the graphene sheet G
2
converted large
(several hundred
˚
angstr
¨
oms) movements of the actuator into much smaller
deformations of G
2
. The resulting reduction of the separation between G
1
and
G
2
(Fig. 5d, inset) was inferred from three measured quantities: (1) the relaxed
interlayer spacing, d
0
(G
1
,G
2
) =3.0
˚
A, determined by e lectron diffraction;
(2) the interlayer resistance between the undeformed graphene layer G
2
and the
underlying layer G
1
(10 k at d
0
(G
1
,G
2
) =3.0
˚
A); and (3) the resistance for
G
1
→G
1
transport, assumed equal to the resistance between G
1
and G
2
at zero
spacing (10 at d(G
1
,G
2
) =0). Using the interlayer resistances at 3.0
˚
A and
zero spacing as known end points, an exponential fit to the measured resistance
as a function of actuator position provided the conversion between actuator
elongation and deformation of G
2
, assuming that the two are proportional to
each other (that is, differ by a constant factor). All four-probe current–voltage
curves were measured with the sample held at room temperature, using a
programmable semiconductor test system (Keithley, model 4200SCS).
Received 16 November 2007; accepted 12 March 2008; published 6 April 2008.
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